Division

R&D

Department

EV Electronics

Level

Ex

Functional Area

HVDC hardware

1

Job Title

Manager (R&D)

2

Reporting

Leadership, R&D – EV Electronics

3

Educational Qualification

B.E/ B Tech in Electrical, Electronics/Instrumentation and Equivalent Streams, M Tech in Power Electronics (preferred),

PhD in Power Electronics domain, min 70% in all levels of education

Experience

4 to 12 yrs

Age Limit

NA

4

Job Role & Responsibilities

Role: Power Electronics Engineer

Technical/Functional:

1. PCB Layout Design for Power Electronics:
   • Design multi-layer PCBs for high-power motor controllers, DC-DC converters, inverters, and battery management systems (BMS).
   • Optimize power planes, creepage & clearance distances, and thermal dissipation for high-voltage (>96V) and high-current applications.
   • Ensure low-inductance routing, controlled impedance, and effective grounding strategies for high-power circuits.
   • Select appropriate PCB materials (FR4, Rogers, Polyimide, etc.) for high-reliability applications.
   • Implement EMI/EMC best practices, including shielding, filtering, and differential pair routing.
2. PCB Layout for RF & High-Speed Designs:
   • Design PCBs for RF modules, antennas, and high-speed signal transmission (GHz range).
   • Implement microstrip, stripline, coplanar waveguides, and controlled impedance routing.
   • Optimize layouts for minimum crosstalk, reflection, and insertion loss.
   • Work closely with RF engineers for layout optimization, grounding, and signal integrity enhancements.
   • Conduct EMI simulations and compliance testing to meet RF regulatory standards.
3. PCB Layout for Analog & Mixed-Signal Circuits:
   • Design low-noise, precision analog circuit layouts, including op-amps, ADCs, DACs, and sensor interfaces.
   • Implement star-grounding, guard rings, and Kelvin sensing techniques for ultra-low- noise performance.
   • Optimize high-precision data acquisition and mixed-signal PCB layouts.
   • Ensure minimized parasitic capacitance and inductance in sensitive analog circuits.
4. Thermal & Mechanical Considerations:
   • Design thermal vias, heat sinks, copper pours, and metal core PCBs (MCPCB) for high-power applications.
   • Work closely with mechanical engineers to optimize PCB integration within enclosures and cooling solutions.
   • Work closely with CFTs to perform thermal simulations and power dissipation analysis for PCB heat management.
5. Design Validation & Compliance:
   • Perform DFM (Design for Manufacturability), DFA (Design for Assembly), and DFT (Design for Testability) analysis.
   • Collaborate with fabrication and assembly vendors to ensure high-yield production.
   • Ensure compliance with IPC standards (IPC-2221, IPC-600, IPC-6012), EMI/EMC regulations, and automotive/industrial safety norms.

5

Competency Requirements

Behavioral:

• Demonstrates excellent communication skills, both written and verbal.
• Serves as an effective team player with the capability to lead and mentor a group of engineers.
• Anticipates challenges, takes proactive actions, and fosters a culture of continuous improvement.
• Creates and maintains comprehensive technical documentation, including design calculations.
• Encourages innovation in technology and cost optimization, promoting intellectual property (IP) generation within the team.
• Possesses the ability to transform concepts into practical, real-world solutions.
• Communicates effectively with team members, peers, suppliers, and senior leadership.
• Collaborates seamlessly with cross-functional teams to develop innovative and impactful solutions.