Division: R&D
Department: EV Electronics
Level: Ex
Functional Area: Electronics Manufacturing Engineering - SMT
1 Job Title: Electronics SMT Engineer
2 Reporting: Functional reporting to Div Manager, R&D – Electronics
3 Background
i) Educational Qualification
Essential: B.E/ B Tech in Electrical/Electronics, M Tech in Electrical/Electronics is preferred; Min. 70% score required at all levels of education
ii) Experience: Minimum: 4, Maximum: 15
iii) Age Limit: Minimum: 24, Maximum: 40
4 Job Role & Responsibilities Role: Electronics SMT Engineer
Technical/ Functional:
• Own end-to-end execution of prototype and pilot SMT builds (NPI, EVT, DVT, PVT stages).
• Define and set up SMT process parameters for new PCB designs including Stencil design and thickness selection, Solder paste selection, Pick-and-place programming and optimization, Reflow profile development and validation
• Support rapid prototype by coordinating with hardware design & PCB layout teams, Supplier quality, sourcing, and manufacturing teams
• Drive first-time-right builds by proactively identifying manufacturability, assembly, and yield risks.
• Establish and optimize SMT processes for all type of High-density, multi-layer automotive PCBs and SMD +THT components (Fine-pitch BGAs, QFNs, LGA, DFN, CSP, bottom-terminated components)
• Lead process capability improvement (Cp/Cpk, defect PPM reduction).
• Define and monitor process control plans and critical process windows.
• Troubleshoot SMT defects such as Tombstoning, solder bridging, opens, voiding, Head-in-pillow, BGA shorts/opens, Component skew, insufficient solder, non-wetting etc.
• Review AOI, SPI, and X-ray results and drive corrective actions.
• Support FAI (First Article Inspection) and build sign-off for proto runs.
• Prepare and maintain SMT process documentation, Build reports, defect Pareto, yield analysis, lessons-learned for design and process feedback
• Support continuous improvement initiatives across internal and vendor SMT lines.
• Perform SMT line audits at vendor facilities covering Line capability and equipment readiness, Process controls, ESD practices, traceability, Operator skill levels and work instructions.
• Review and approve SMT process flow, Control plans, PFMEA, inspection criteria, Reflow profiles and stencil designs at vendor lines
• Interpret and ensure compliance with all the relevant standard requirement such as IPC-A-610 (Class 2 / Class 3 as applicable), IPC-J-STD-001, agreed BOM, PCB stack-up, and assembly notes.
• Support vendor issue resolution, including root cause analysis (8D, 5-Why, Fishbone).
• Define and execute incoming, in-process, and outgoing quality checks for proto and vendor builds. 5 Competency Requirements
Behavioural:
• Strong ownership mindset with ability to drive proto builds independently.
• Hands-on, problem-solving approach with high attention to detail.
• Demonstrates agility while working in fast-paced NPI environments, effectively managing frequent changes and tight timelines.
• Quality-first mindset aligned with automotive reliability expectations.
• Collaborates seamlessly with cross-functional teams to develop innovative and impactful solutions.
• Demonstrates excellent communication skills, both written and verbal.
• Serves as an effective team player with the capability to lead and mentor a group of engineers.
• Anticipates challenges, takes proactive actions, and fosters a culture of continuous improvement.
• Creates and maintains comprehensive technical documentation, process control parameters.
• Encourages innovation in technology and cost optimization, promoting intellectual property (IP) generation within the team.
• Communicates effectively with team members, peers, suppliers, and senior leadership.
Specific expertise required for functional area:
• Strong understanding of SMT assembly processes and equipment (Screen printers, pick-and-place machines, reflow ovens, AOI, SPI, X-ray inspection systems)
• Hands-on experience with reflow profile tuning, defect analysis and rework practices
• Solid knowledge of PCB fabrication basics (stack-up, surface finishes).
• Component packaging and moisture sensitivity (MSL handling)
• Working knowledge of IPC standards (IPC-A-610, J-STD-001), Automotive / high reliability exposure.
• Experience with automotive electronics SMT lines.
• Familiarity with ESD control, traceability, lot control, PFMEA, Control Plans, Process Audits.
• Exposure to proto to mass-production transition
• Excellent problem-solving skills and attention to detail.
• Proficient in using common laboratory equipment, such as oscilloscopes, digital multimeter, network analyzers, and spectrum analyzers.
6 Likely Sources: Bosch, Harman, Philips, Havells, Tata Electronics, Foxconn, Flex Ltd., Jabil, Sanmina, Dixon Technologies, VVDN, Kaynes Technology, SFO Technologies, Syrma SGS Technology, Avalon Technologies, Mefron Technologies, Centum Electronics etc